MIL-V-173 Varnish, Moisture-and-Fungus Resistant (for Treatment of Communications, Electronic, and Associated Equipment)

This specification covers one type of moisture-and-fungus-resistant varnish consisting of a para-phenyl phenol-formaldehyde resin in combination with tung oil and suitable solvents which has been made fungistatic by the addition of 7.0 +/- 1.0 percent salicylanilide or one percent copper b-quinolinolate, for the treatment of assembled communications, electronic, and associated electrical equipment.